KUCHING: Sarawak is stepping up efforts to cement its place in the global semiconductor industry with the launch of the Sarawak Semiconductor Roadmap 2030, aimed at boosting investments, creating high-skilled jobs and driving homegrown innovation.
Premier Datuk Patinggi Tan Sri Abang Johari Tun Openg, who unveiled the roadmap at the X-FAB Sarawak 40K Fab opening ceremony yesterday, said the initiative signals the state’s long-term commitment to developing a competitive and future-ready workforce.
“This initiative is a strategic and forward-looking signal to the industry that Sarawak is committed to nurturing a resilient, highly skilled and future-ready workforce to meet the demands of our rapidly growing economy,” he said.
The roadmap sets out plans to attract RM2 billion in funding, collaborate with more than 10 global industry players, create 3,000 high-skilled jobs and commercialise new intellectual properties.
A key project under the roadmap is the SMD Advanced Chip Integration Centre at Sama Jaya, developed with Compound Semiconductor Applications Catapult and the Welsh Government, which Abang Johari described as the backbone of Sarawak’s global research and development ecosystem.
He also highlighted a strategic partnership with X-FAB in Dresden, Germany, and Cambridge Microelectronics to develop compound semiconductor-based chips using Gallium Nitride.
“This strategic partnership will enable us to design and develop our own chip while transferring advanced technology to Sarawak, ensuring our place as a competitive leader in the national semiconductor industry,” he said.
Abang Johari added that Sarawak is positioning itself as a hub for high-value semiconductor activities.
“We are positioning Sarawak not just as a participant but as a competitive leader in the global semiconductor ecosystem,” he said.
